[B1] U. R. Tida, C. Zhuo, and Y. Shi (2015).
“Green On-chip Inductors for Three-Dimensional Integrated Circuits: Concepts, Algorithms and Applications.”
In CMOS and Post-CMOS Perspectives of Electronic Device Scaling, IET Publishing.
[Publisher]
Journal Publications
[J10] R. S. Balamurugan, Y. Asad, T. Gao, D. Nawarathna, U. R. Tida, and D. Sun (2025).
“Automating the Amino Acid Identification in Elliptical Dichroism Spectrometer with Machine Learning.”
PLOS ONE.
[PLOS ONE]
[J9] Y. Asad, K. P. Jangili, A. Arshad, M. Elma, K. Rasuleva, A. Akinlalu, T. Gao, U. R. Tida, W. Xia, and D. Sun (2024).
“Characterizing Biomolecular Structure Features Through An Innovative Elliptical Dichroism Spectrometry for Cancer Detection.”
Heliyon.
[Heliyon]
[J8] M. S. Vemuri and U. R. Tida (2023).
“Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC.”
IEEE Access.
[IEEE Access]
[J7] M. Elma, M. S. Vemuri, and U. R. Tida (2023).
“Design, Analysis and Optimization of Magnetic-Core Solenoid Inductor for On-Chip Multi-Phase Buck Converter.”
IEEE Access.
[IEEE Access]
[J6] L. Velmanickam, V. Jayasooriya, M. S. Sarma, U. R. Tida, and D. Nawarathna (2021).
“Recent advances in dielectrophoresis toward biomarker detection: A summary of studies published between 2014 and 2021.”
Electrophoresis.
[Wiley]
[J5] B. Chen, U. R. Tida, C. Zhuo, and Y. Shi (2022).
“Magnetic Core TSV-Inductor and Optimization for On-chip DC-DC Converter.”
ACM Transactions on Design Automation of Electronic Systems (TODAES).
[ACM DL]
[J4] U. R. Tida, C. Zhuo, and Y. Shi (2020).
“Single-Inductor-Multiple-Tier-Regulation: TSV-Inductor Based On-chip Buck Converters for 3D-IC Power Delivery.”
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.
[IEEE Xplore]
[J3] U. R. Tida, C. Zhuo, and Y. Shi (2019).
“Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking.”
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).
[IEEE Xplore]
[J2] U. R. Tida, C. Zhuo, and Y. Shi (2014).
“Novel Through-Silicon-Via Inductor Based On-chip DC-DC Converter Designs in 3D ICs.”
ACM Journal on Emerging Technologies in Computing Systems (JETC).
[ACM DL]
[J1] U. R. Tida, R. Yang, C. Zhuo, and Y. Shi (2015).
“On the Efficacy of Through-Silicon-Via Inductors.”
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.
[IEEE Xplore]
Conference Publications
[C16] M. Elma, N. Goli and U. R. Tida (2025). Machine Learning Assisted Magnetic-core Coupled Inductor Design for Interleaved Buck Converter. 26th International Symposium on Quality Electronic Design (ISQED). [Link]
[C15] M. S. Vemuri, T. Ahmed and U. R. Tida (2024). Compact 6T-SRAM using Bottom-Gate Transistor in FD-SOI Process for Monolithic-3D Integration. IEEE Computer Society Annual Symposium on VLSI (ISVLSI). [Link]
[C14] M. S. Vemuri and U. R. Tida (2024). Design Approaches and Considerations for a Reliable and Efficient Monolithic 3D Integration. IEEE Computer Society Annual Symposium on VLSI (ISVLSI). [Link]
[C13] M. S. Vemuri and U. R. Tida (2023). Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in M3D-IC Technology. 41st IEEE International Conference on Computer Design (ICCD). [Link]
[C12] M. S. Vemuri and U. R. Tida (2023). FDSOI Process Based MIV-Transistor Utilization for Standard Cell Designs in Monolithic 3D Integration. 36th IEEE International System-on-Chip Conference (SoCC). [Link]
[C11] M. S. Vemuri and U. R. Tida (2023). Efficient and Scalable MIV Transistor with Extended Gate in Monolithic 3D Integration. IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS). [Link]
[C10] M. S. Vemuri and U. R. Tida (2023). Metal Inter-Layer Via Keep-out-zone in M3D IC: A Critical Process-Aware Design Consideration. 24th International Symposium on Quality Electronic Design (ISQED). [Link]
[C9] D. Li, Y. Zhou, U. R. Tida, and Z. Liu (2021). An energy-efficient LDO for bioimplantable devices. International Conference on Electronic Devices and Applications (ICEDA). [Link]
[C8] U. R. Tida and M. S. Vemuri (2020). Efficient Metal Inter-Layer Via Utilization Strategies for Three-dimensional Integrated Circuits. 33rd IEEE International System-on-Chip Conference (SoCC) (invited). [Link]
[C7] M. S. Vemuri and U. R. Tida (2020). Design and Optimization of Magnetic-core Solenoid Inductor for Multi-phase Buck Converter. IEEE 63rd International Midwest Symposium on Circuits and Systems (MWSCAS). [Link]
[C6] M. S. Vemuri and U. R. Tida (2020). Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration. IEEE 63rd International Midwest Symposium on Circuits and Systems (MWSCAS). [Link]
[C5] B. Chen, U. R. Tida, C. Zhuo, and Y. Shi (2018). Modeling and Optimization of Magnetic Core TSV-Inductor for On-Chip DC-DC Converter. IEEE/ACM Proceedings of the International Conference on Computer-Aided Design (ICCAD). [Link]
[C4] P. N. Kankonkar, U. R. Tida, C. Zhuo, and Y. Shi (2016). PWM-Controlled DC-DC Converter Designs in 3D ICs using Through-Silicon-Via Inductors. IEEE Semiconductor Technology International Conference (CSTIC). [Link]
[C3] U. R. Tida, C. Zhuo and Y. Shi (2014). Through-Silicon-Via Inductor: Is it Real or Just A Fantasy? IEEE/ACM Proc. of Asia and South Pacific Design Automation Conference (ASP-DAC). [Link]
[C2] U. R. Tida, V. Mittapalli, C. Zhuo and Y. Shi (2014). “Green” On-chip Inductors in Three-Dimensional Integrated Circuits. IEEE Proc. of Computer Society Annual Symposium on VLSI (ISVLSI) (Invited). [Link]
[C1] U. R. Tida, V. Mittapalli, C. Zhuo and Y. Shi (2014). Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clock: Concept and Algorithms. IEEE/ACM Proc. of International Conference on Computer-Aided Design (ICCAD). [Link]