Publications & Talks

U. R. Tida, C. Zhuo, and Y. Shi (2015). "Green On-chip Inductors for Three-Dimensional Integrated Circuits: Concepts, Algorithms and Applications." In CMOS and Post-CMOS Perspectives of Electronic Device Scaling, IET Publishing. [Publisher]

S. Thapa, J. Steigauf, U. R. Tida, and J. Y. Kim. "Enhancing Dataset Quality for AI Models using Zero-Shot Generalization in Agriculture Imagery." ASABE Controlled Environment Agriculture.

M. Elma, I. Akinfemisoye, N. Goli, and U. R. Tida. "Machine Learning assisted Modeling, Design and Optimization of On-chip Coupled Magnetic Inductor for Efficient Interleaved Buck Converter Design." ACM Transactions on Design Automation of Electronic Systems.

I. Akinfemisoye, M. S. Vemuri, and U. R. Tida. "Modeling and Design of 6T SRAM with Opportunistic Utilization of Bottom-gate Transistor in FD-SOI Process for Monolithic 3D Integration." IEEE Transactions in VLSI Design (TVLSI).

X. Zhang, R. B. Balamurugan, M. S. Vemuri, U. R. Tida, and J. Y. Kim. "A Comparative Study of U-Net and YoloV11 for Weed Segmentation." ASABE Applied Engineering in Agriculture.

A. Wijesinghe, R. B. Balamurugan, U. R. Tida, and D. Nawarathna. "High-throughput Printing-free Nucleic Acid Microarrays Using AC Electric Fields." ACS Analytical Chemistry.

D. Yu, N. Goli, Y. Ishimura, Y. Li, U. R. Tida, and Z. Jia. "SoK: Towards a User-Centric, Privacy-Preserving, and Reliable AI Agent via On-Device LLM Personalization." High-confidence Computing.

R. S. Balamurugan, Y. Asad, T. Gao, D. Nawarathna, U. R. Tida, and D. Sun. "Automating the Amino Acid Identification in Elliptical Dichroism Spectrometer with Machine Learning." PLOS ONE. [PLOS ONE]

Y. Asad, K. P. Jangili, A. Arshad, M. Elma, K. Rasuleva, A. Akinlalu, T. Gao, U. R. Tida, W. Xia, and D. Sun. "Characterizing Biomolecular Structure Features Through An Innovative Elliptical Dichroism Spectrometry for Cancer Detection." Heliyon. [Heliyon]

M. S. Vemuri and U. R. Tida. "Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC." IEEE Access. [IEEE Access]

M. Elma, M. S. Vemuri, and U. R. Tida. "Design, Analysis and Optimization of Magnetic-Core Solenoid Inductor for On-Chip Multi-Phase Buck Converter." IEEE Access. [IEEE Access]

L. Velmanickam, V. Jayasooriya, M. S. Sarma, U. R. Tida, and D. Nawarathna. "Recent advances in dielectrophoresis toward biomarker detection: A summary of studies published between 2014 and 2021." Electrophoresis. [Wiley]

B. Chen, U. R. Tida, C. Zhuo, and Y. Shi. "Magnetic Core TSV-Inductor and Optimization for On-chip DC-DC Converter." ACM Transactions on Design Automation of Electronic Systems (TODAES). [ACM DL]

U. R. Tida, C. Zhuo, and Y. Shi. "Single-Inductor-Multiple-Tier-Regulation: TSV-Inductor Based On-chip Buck Converters for 3D-IC Power Delivery." IEEE Transactions on Very Large Scale Integration (VLSI) Systems. [IEEE Xplore]

U. R. Tida, C. Zhuo, and Y. Shi. "Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking." IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD). [IEEE Xplore]

U. R. Tida, C. Zhuo, and Y. Shi. "Novel Through-Silicon-Via Inductor Based On-chip DC-DC Converter Designs in 3D ICs." ACM Journal on Emerging Technologies in Computing Systems (JETC). [ACM DL]

U. R. Tida, R. Yang, C. Zhuo, and Y. Shi. "On the Efficacy of Through-Silicon-Via Inductors." IEEE Transactions on Very Large Scale Integration (VLSI) Systems. [IEEE Xplore]

X. Li, A. Vardar, F. Muller, N. Goli, U. R. Tida, K. Ni, x. S. Hu, T. Kampfe, and R. Qin. "CQ-CiM: Hardware-Aware Embedding Shaping for Robust CiM-Based Retrieval." Design Automation Conference. (Acceptance Rate: 22.3%)

J. Steigauf, S. Thapa, U. R. Tida and J. Y. Kim. "High Quality Dataset for Learning Models." ASABE Annual International Meeting.

U. Mahato, N. Goli, U. R. Tida and J. Y. Kim. "Accurate Pixel-Wise Object Detection Framework for Aerial Imagery." ASABE Annual International Meeting.

M. Elma, N. Goli and U. R. Tida. "Machine Learning Assisted Magnetic-core Coupled Inductor Design for Interleaved Buck Converter." 26th International Symposium on Quality Electronic Design (ISQED).

A. Wijesinghe, R. Balamurugan, U. R. Tida and D. Nawarathna. "Controlled Concentration of Short DNA Molecules on The Electrodes Using AC Electric Fields and Capillary Flow." IEEE Research and Applications of Photonics in Defense Conference (RAPID).

J. Y. Kim, R. S. Balamurugan, M. S. Vemuri, and U. R. Tida. "Weed Identification Using U-Net Machine Learning Model and SAM Segmentation." ASABE Annual International Meeting.

M. S. Vemuri, T. Ahmed and U. R. Tida. "Compact 6T-SRAM using Bottom-Gate Transistor in FD-SOI Process for Monolithic-3D Integration." IEEE Computer Society Annual Symposium on VLSI (ISVLSI). [Link]

M. S. Vemuri and U. R. Tida. "Design Approaches and Considerations for a Reliable and Efficient Monolithic 3D Integration." IEEE Computer Society Annual Symposium on VLSI (ISVLSI). [Link]

N. Vandal, U. R. Tida and D. Nawarathna. "Label Free Flow Cytometry Using Machine Learning." IEEE Research and Applications of Photonics in Defense Conference (RAPID).

M. S. Vemuri and U. R. Tida. "Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in M3D-IC Technology." 41st IEEE International Conference on Computer Design (ICCD). [Link]

M. S. Vemuri and U. R. Tida. "FDSOI Process Based MIV-Transistor Utilization for Standard Cell Designs in Monolithic 3D Integration." 36th IEEE International System-on-Chip Conference (SoCC). [Link]

M. S. Vemuri and U. R. Tida. "Efficient and Scalable MIV Transistor with Extended Gate in Monolithic 3D Integration." IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS). [Link]

M. S. Vemuri and U. R. Tida. "Metal Inter-Layer Via Keep-out-zone in M3D IC: A Critical Process-Aware Design Consideration." 24th International Symposium on Quality Electronic Design (ISQED). [Link]

D. Li, Y. Zhou, U. R. Tida, and Z. Liu. "An energy-efficient LDO for bioimplantable devices." International Conference on Electronic Devices and Applications (ICEDA). [Link]

U. R. Tida and M. S. Vemuri. "Efficient Metal Inter-Layer Via Utilization Strategies for Three-dimensional Integrated Circuits." 33rd IEEE International System-on-Chip Conference (SoCC). [Link]

M. S. Vemuri and U. R. Tida. "Design and Optimization of Magnetic-core Solenoid Inductor for Multi-phase Buck Converter." IEEE 63rd International Midwest Symposium on Circuits and Systems (MWSCAS). [Link]

M. S. Vemuri and U. R. Tida. "Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration." IEEE 63rd International Midwest Symposium on Circuits and Systems (MWSCAS). [Link]

B. Chen, U. R. Tida, C. Zhuo, and Y. Shi. "Modeling and Optimization of Magnetic Core TSV-Inductor for On-Chip DC-DC Converter." IEEE/ACM International Conference on Computer-Aided Design (ICCAD). [Link]

P. N. Kankonkar, U. R. Tida, C. Zhuo, and Y. Shi. "PWM-Controlled DC-DC Converter Designs in 3D ICs using Through-Silicon-Via Inductors." IEEE Semiconductor Technology International Conference (CSTIC). [Link]

U. R. Tida, C. Zhuo and Y. Shi. "Through-Silicon-Via Inductor: Is it Real or Just A Fantasy?" IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC). [Link]

U. R. Tida, V. Mittapalli, C. Zhuo and Y. Shi. "Green On-chip Inductors in Three-Dimensional Integrated Circuits." IEEE Computer Society Annual Symposium on VLSI (ISVLSI). [Link]

U. R. Tida, V. Mittapalli, C. Zhuo and Y. Shi. "Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clock: Concept and Algorithms." IEEE/ACM International Conference on Computer-Aided Design (ICCAD). [Link]

IEEE Computer Society Annual Symposium on VLSI.
Talk: "Green" On-chip Inductors in Three-Dimensional Integrated Circuits

Asia and South Pacific Design Automation Conference.
Talk: Through-Silicon-Via Inductor: Is it Real or Just A Fantasy?

INTEL Power Delivery Team, INTEL Research.
Talk: Characterizing Differential Buffers for I/O Circuit Design

SIGDA PhD Forum at IEEE/ACM Design Automation Conference.
Talk: "Green" On-chip Inductors in Three-Dimensional Integrated Circuits

INTEL Labs, INTEL Research.
Talk: Modeling, Design and Analysis of Magnetic-Core Inductor Design for On-Chip Power Converters

Georgia Institute of Technology.
Talk: Through-Silicon-Via Devices and Circuits: Towards Submillimeter Sensing for Geo-Data Mining

Student Research Competition, IEEE/ACM International Conference on Computer-Aided Design.
Talk: Through-Silicon-Via Devices and Circuits

IEEE/ACM International Conference on Computer Aided Design.
Talk: Modeling and Optimization of Magnetic Core TSV-Inductor for On-Chip DC-DC Converter

North Dakota State University.
Talk: Through-Silicon-Via Devices and Circuits for Submillimeter Scale Sensors

National Tsing Hua University.
Talk: Through-Silicon-Via Devices and Circuits for Submillimeter Scale Sensors

IEEE International System On-chip Conference.
Talk: Efficient Metal Inter-Layer Via Utilization Strategies for Three-Dimensional Integrated Circuits

University of Alabama in Huntsville.
Talk: System-level Design and Automation for Process-aware Efficient and Reliable Monolithic 3D Integration

Indiana University Bloomington.
Talk: System-level Design and Automation for Process-aware Efficient and Reliable Monolithic 3D Integration

Oklahoma State University Stillwater.
Talk: System-level Design and Automation for Process-aware Efficient and Reliable Monolithic 3D Integration

Auburn University.
Talk: System-level Design and Automation for Process-aware Efficient and Reliable Monolithic 3D Integration

University of Texas San Antonio.
Talk: System-level Design and Automation for Process-aware Efficient and Reliable Monolithic 3D Integration

University of Cincinnati.
Talk: System-level Design and Automation for Process-aware Efficient and Reliable Monolithic 3D Integration

Missouri University of Science and Technology.
Talk: System-level Design and Automation for Process-aware Efficient and Reliable Monolithic 3D Integration

Louisiana State University.
Talk: System-level Design and Automation for Process-aware Efficient and Reliable Monolithic 3D Integration

Clemson University.
Talk: System-level Design and Automation for Process-aware Efficient and Reliable Monolithic 3D Integration