U. R. Tida et al. (2015). "Green On-chip Inductors for Three-Dimensional Integrated Circuits." In CMOS and Post-CMOS Perspectives. [Link Placeholder]
Journal Publications
[J10] R. S. Balamurugan et al. (2025). Automating Amino Acid Identification. [IEEE Xplore]
[J9] Y. Asad et al. (2024). Biomolecular Structure Features. [Link Placeholder]
[J8] M. S. Vemuri, U. R. Tida (2023). Dual-Purpose MIV in M3D IC. [IEEE Xplore]
[J7] M. Elma, M. S. Vemuri, U. R. Tida (2023). Magnetic-Core Solenoid Inductor. [IEEE Xplore]
[J6] L. Velmanickam et al. (2021). Advances in Dielectrophoresis. [Link Placeholder]
[J5] B. Chen, U. R. Tida et al. (2022). Magnetic Core TSV-Inductor. [ACM DL]
[J4] U. R. Tida et al. (2020). Single-Inductor-Multiple-Tier Regulation. [IEEE Xplore]
[J3] U. R. Tida et al. (2019). Dynamic Frequency Scaling with TSV Inductors. [IEEE Xplore]
[J2] U. R. Tida et al. (2014). Novel TSV Inductor Based DC-DC Converter. [ACM DL]
[J1] U. R. Tida et al. (2015). Efficacy of TSV Inductors. [IEEE Xplore]
Conference Publications
[C16] M. Elma, N. Goli and U. R. Tida (2025). Machine Learning Assisted Magnetic-core Coupled Inductor Design for Interleaved Buck Converter. 26th International Symposium on Quality Electronic Design (ISQED). [Link]
[C15] M. S. Vemuri, T. Ahmed and U. R. Tida (2024). Compact 6T-SRAM using Bottom-Gate Transistor in FD-SOI Process for Monolithic-3D Integration. IEEE Computer Society Annual Symposium on VLSI (ISVLSI). [Link]
[C14] M. S. Vemuri and U. R. Tida (2024). Design Approaches and Considerations for a Reliable and Efficient Monolithic 3D Integration. IEEE Computer Society Annual Symposium on VLSI (ISVLSI). [Link]
[C13] M. S. Vemuri and U. R. Tida (2023). Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in M3D-IC Technology. 41st IEEE International Conference on Computer Design (ICCD). [Link]
[C12] M. S. Vemuri and U. R. Tida (2023). FDSOI Process Based MIV-Transistor Utilization for Standard Cell Designs in Monolithic 3D Integration. 36th IEEE International System-on-Chip Conference (SoCC). [Link]
[C11] M. S. Vemuri and U. R. Tida (2023). Efficient and Scalable MIV Transistor with Extended Gate in Monolithic 3D Integration. IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS). [Link]
[C10] M. S. Vemuri and U. R. Tida (2023). Metal Inter-Layer Via Keep-out-zone in M3D IC: A Critical Process-Aware Design Consideration. 24th International Symposium on Quality Electronic Design (ISQED). [Link]
[C9] D. Li, Y. Zhou, U. R. Tida, and Z. Liu (2021). An energy-efficient LDO for bioimplantable devices. International Conference on Electronic Devices and Applications (ICEDA). [Link]
[C8] U. R. Tida and M. S. Vemuri (2020). Efficient Metal Inter-Layer Via Utilization Strategies for Three-dimensional Integrated Circuits. 33rd IEEE International System-on-Chip Conference (SoCC) (invited). [Link]
[C7] M. S. Vemuri and U. R. Tida (2020). Design and Optimization of Magnetic-core Solenoid Inductor for Multi-phase Buck Converter. IEEE 63rd International Midwest Symposium on Circuits and Systems (MWSCAS). [Link]
[C6] M. S. Vemuri and U. R. Tida (2020). Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration. IEEE 63rd International Midwest Symposium on Circuits and Systems (MWSCAS). [Link]
[C5] B. Chen, U. R. Tida, C. Zhuo, and Y. Shi (2018). Modeling and Optimization of Magnetic Core TSV-Inductor for On-Chip DC-DC Converter. IEEE/ACM Proceedings of the International Conference on Computer-Aided Design (ICCAD). [Link]
[C4] P. N. Kankonkar, U. R. Tida, C. Zhuo, and Y. Shi (2016). PWM-Controlled DC-DC Converter Designs in 3D ICs using Through-Silicon-Via Inductors. IEEE Semiconductor Technology International Conference (CSTIC). [Link]
[C3] U. R. Tida, C. Zhuo and Y. Shi (2014). Through-Silicon-Via Inductor: Is it Real or Just A Fantasy? IEEE/ACM Proc. of Asia and South Pacific Design Automation Conference (ASP-DAC). [Link]
[C2] U. R. Tida, V. Mittapalli, C. Zhuo and Y. Shi (2014). “Green” On-chip Inductors in Three-Dimensional Integrated Circuits. IEEE Proc. of Computer Society Annual Symposium on VLSI (ISVLSI) (Invited). [Link]
[C1] U. R. Tida, V. Mittapalli, C. Zhuo and Y. Shi (2014). Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clock: Concept and Algorithms. IEEE/ACM Proc. of International Conference on Computer-Aided Design (ICCAD). [Link]